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Laser Solder Ball Jetting
Advanced non-contact soldering system. Features flux-free bonding and micron-level precision for heat-sensitive components like VCM and BGA. Supports solder balls from 70µm to 2.0mm
Laser Wire Stripping
Cold ablation technology for high-speed & micro-coaxial cables. Ensures damage-free stripping of shielding and insulation layers with Zero Heat-Affected Zone (HAZ) and no carbonization
Precision Micro-Machining
UV Femtosecond laser solution for semiconductors and thin films. Achieves positioning accuracy of ≤±2µm and minimum cutting widths of <20µm, ideal for micro-grooves and grid cutting
Free Process Validation
We offer free feasibility testing services. Send us your samples, and we will provide a comprehensive report including metallographic analysis to verify process quality before you buy
Technical Support
Frequently Asked Questions
Below are answers to the most common questions regarding our laser welding technology, equipment maintenance, and process capabilities
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