Solutions

  • Home
  • Service
Laser Solder Ball Jetting

Laser Solder Ball Jetting

Advanced non-contact soldering system. Features flux-free bonding and micron-level precision for heat-sensitive components like VCM and BGA. Supports solder balls from 70µm to 2.0mm

Laser Wire Stripping

Laser Wire Stripping

Cold ablation technology for high-speed & micro-coaxial cables. Ensures damage-free stripping of shielding and insulation layers with Zero Heat-Affected Zone (HAZ) and no carbonization

Precision Micro-Machining

Precision Micro-Machining

UV Femtosecond laser solution for semiconductors and thin films. Achieves positioning accuracy of ≤±2µm and minimum cutting widths of <20µm, ideal for micro-grooves and grid cutting

Free Process Validation

Free Process Validation

We offer free feasibility testing services. Send us your samples, and we will provide a comprehensive report including metallographic analysis to verify process quality before you buy

Technical Support

Frequently Asked Questions

Below are answers to the most common questions regarding our laser welding technology, equipment maintenance, and process capabilities

It is a non-contact, flux-free process that eliminates mechanical stress and contamination. It features precise temperature control with minimal heat-affected zone (HAZ), making it ideal for heat-sensitive components like camera modules and BGA rework.

Learn More
gemini generated image g38jgwg38jgwg38j
0 hours+
Online Response

Warning: realpath(): open_basedir restriction in effect. File(/www/server/panel) is not within the allowed path(s): (/usr/local/lighthouse/softwares/wordpress/:/tmp/) in /usr/local/lighthouse/softwares/wordpress/wp-includes/l10n/class-wp-translation-controller.php on line 106